The FX36 Series board-to-board connectors are designed for space-constrained, harsh-environment applications.
Hirose
Hirose (Downers Grove, IL) has expanded its FunctionMAX family of floating board-to-board connectors to include a high-density version designed for space-constrained, harsh-environment applications.
With a 0.5 mm pitch, the FX36 Series supports high-density mounting, improves design flexibility and enables application miniaturization, weight reduction and more efficient automated assembly, according to the company. With a high heat resistance of 125°C, the board-to-board connector is designed for automotive powertrain applications, particularly BEV and HEV multifunctional systems such as X-in-1 units with strict board layout requirements.
The FX36 Series provides:
- Misalignment absorption of ±0.7mm in the X and Y directions, and ±0.5 mm in the Z direction.
- Vibration absorption of 0.05 mm in the Z direction.
- A two-point contact design that supports highly reliable connections in vibration-prone applications.
- Heat resistance up to 125°C.
For more information, visit https://www.hirose.com/.
